PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a technique capable of suppressing generation of development residues in a hole part such as a through hole, in a solder resist composition containing titanium oxide.SOLUTION: There is provided a photosensitive resin composition containing (A) a carboxyl group-containing resin, (B) an epoxy-based thermosetting component, (C) an inorganic filler, and (D) a photopolymerization initiator. The equivalent of epoxy groups contained in the epoxy-based thermosetting component (B) per equivalent of carboxyl groups contained in the carboxyl group-containing resin (A) is 1.0 or less. The epoxy-based thermosetting component (B) contains at least one epoxy resin which is liquid at 20°C. The inorganic filler (C) contains titanium oxide. There are also provided a dry film using the photosensitive resin composition and a cured product thereof.