发明名称 Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same
摘要 An apparatus is provided for supporting a PCB substrate during printing. The apparatus includes first and second fixing units that cooperate to edge-clamp the substrate. The first fixing unit includes a first movable plate, a first actuator, and a first stopper that limits outward movement of the first movable plate. The second fixing unit includes a second movable plate, a second actuator, and a second stopper that limits outward movement of the second movable plate. When printing the substrate from the first edge to the second edge, the first and second fixing units operate so that the second actuator moves the second movable plate outwardly to contact the second stopper, and the first actuator moves the first movable plate inwardly to press the substrate toward the second movable plate. When printing the substrate from the second edge to the first edge the first and second fixing units operate oppositely.
申请公布号 US2008087178(A1) 申请公布日期 2008.04.17
申请号 US20070708791 申请日期 2007.02.20
申请人 SAMSUNG TECHWIN CO., LTD.;PHOENIX DIGITAL TECH CO., LTD. 发明人 JO MIN-HYUN;NAM WEON-WOO;KIM JOO-HAN
分类号 H05K3/12;B41M1/12 主分类号 H05K3/12
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