| 发明名称 |
Thermosetting Resin Composition and Use Thereof |
| 摘要 |
A thermosetting resin composition contains a polyimide resin component (A) containing at least one polyimide resin, an amine component (B) containing at least one amine, an epoxy resin component (C) containing at least one epoxy resin, and an imidazole component (D) containing at least one imidazole.
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| 申请公布号 |
US2008230261(A1) |
申请公布日期 |
2008.09.25 |
| 申请号 |
US20050588264 |
申请日期 |
2005.02.22 |
| 申请人 |
TANAKA SHIGERU;SHIMOOSAKO KANJI;ITO TAKASHI;MURAKAMI MUTSUAKI |
发明人 |
TANAKA SHIGERU;SHIMOOSAKO KANJI;ITO TAKASHI;MURAKAMI MUTSUAKI |
| 分类号 |
H05K1/03;C08L63/00;C08L77/00;C08L79/08 |
主分类号 |
H05K1/03 |
| 代理机构 |
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