ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an electronic component which can improve heat dissipation property.

SOLUTION: The electronic component is provided with: a circuit board 3 wherein a wiring electrode 4 is formed to be connected with a circuit element 7 such as an LED element or the like; a first radiating part 11 that is comprised of conductor patterns formed on the surface of the circuit board 3; a second radiating part 12 provided on the rear surface of the circuit board 3; a frame 6 that is in contact with the first radiating part 11 and surrounds the periphery of the circuit element 7; and a connection part 13 that is provided in a hole 3d made in the circuit board 3 and connects the frame 6 and the second radiating part 12. The circuit element 7 is in contact with the first radiating part 11 or the second radiating part 12.

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