发明名称 COMPONENT MOUNTING MACHINE
摘要 Provided are a first component holding tool operating device which operates one component holding tool which is positioned at a first position set on one circumference among the plurality of component holding tools for holding and disengaging a component, and a second holding tool operating device which operates one component holding tool which is positioned at a second position set on the circumference among the plurality of component holding tools for holding and disengaging the component. The first position and the second position are set so that the second position is positioned in the middle of two adjacent component holding tools among the plurality of component holding tools when one of the plurality of component holding tools is positioned at the first position.
申请公布号 US2016249497(A1) 申请公布日期 2016.08.25
申请号 US201315025064 申请日期 2013.10.31
申请人 FUJI MACHINE MFG. CO., LTD. 发明人 ITO Hidetoshi;YASUI Yoshihiro
分类号 H05K13/04;H05K13/00;H05K13/02 主分类号 H05K13/04
代理机构 代理人
主权项 1. A component mounting machine comprising: a board fixing device which fixes a printed circuit board; a component supply device which supplies a component at a plurality of supply positions; a component mounting head which includes (a) a rotating body which is rotatable around a rotation shaft line; (b) a plurality of component holding tools which are installed at an equivalent angle pitch on one circumference around the rotation shaft line, and which respectively hold a component, in the rotating body, and (c) a rotating body rotating device which rotates the rotating body which rotates the plurality of component holding tools along the circumference around the rotation shaft line; a first component holding tool operating device which operates one component holding tool which is positioned at a first position set on the circumference among the plurality of component holding tools for holding and disengaging the component, and a second holding tool operating device which operates one component holding tool which is positioned at a second position set on the circumference among the plurality of component holding tools for holding and disengaging the component; and a head moving device which moves the component mounting head for receiving the component by the plurality of component holding tools from the component supply device, and for mounting the component held by the component holding tools onto the printed circuit board fixed by the board fixing device, wherein the component supplied by the component supply device is mounted on the printed circuit board fixed by the board fixing device, and wherein the first position and the second position are set so that the second position is positioned in the middle of any two adjacent component holding tools among the plurality of component holding tools when one of the plurality of component holding tools is positioned at the first position.
地址 Aichi JP