发明名称 |
Flexible circuit board and method for producing same and bend structure of flexible circuit board |
摘要 |
Provided are a flexible circuit board with excellent bendability and durability against hard conditions particularly in a repeated bend portion having a small curvature radius, and a method of producing the same. The flexible circuit board includes a resin layer and a wiring formed of a metal foil and is used with a bend portion provided at least one position of the wiring. The metal foil is made of a metal having a cubic crystal structure, and a cross section of the wiring cut in a thickness direction from a ridge line in the bend portion forms a principal orientation on any one of planes within a range of (20 1 0) to (1 20 0) in a rotation direction from (100) to (110) with [001] set as a zone axis. The wiring is formed so that the metal foil is made of a metal having a cubic crystal structure, and that the ridge line in the bend portion has an angle in a range of 2.9° to 87.1° relative to one of fundamental crystal axes <100> in a surface of the metal foil. |
申请公布号 |
US9060432(B2) |
申请公布日期 |
2015.06.16 |
申请号 |
US200913001946 |
申请日期 |
2009.06.25 |
申请人 |
NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. |
发明人 |
Hattori Koichi;Kimura Keiichi;Kuwasaki Naoya |
分类号 |
H05K1/09;H05K3/00;H05K1/02;C22F1/08;B21B1/40;B21B3/00;H05K1/03 |
主分类号 |
H05K1/09 |
代理机构 |
Birch, Stewart, Kolasch & Birch, LLP |
代理人 |
Birch, Stewart, Kolasch & Birch, LLP |
主权项 |
1. A method of producing a flexible circuit board including a resin layer and a wiring formed of a metal foil, to be used with a bend portion provided at least at one position of the wiring, the method comprising:
manufacturing a metal-clad laminate having the metal foil and the resin layer, wherein the metal foil comprises a rolled copper foil having a rolling direction MD aligned with a <100> axis direction of the rolled copper foil, and wherein I/I0≧25 is satisfied between an intensity (I) of a (200) plane of the rolled copper foil in the thickness direction, which is obtained by X-ray diffraction, and an intensity (I0) of a (200) plane of a copper fine powder which is obtained by X-ray diffraction, the method further comprising forming a linear wiring so as to have an angle in a range of 26.6° to 63.4° relative to the rolling direction MD of the copper foil so that a cross section of the wiring cut in a thickness direction from a ridge line in the bend portion forms a principal orientation on any one of planes within a range of (210) to (120) in a rotation direction from (100) to (110) with [001] set as a zone axis;
wherein the forming of the linear wiring comprises performing thermal treatment on a rolled copper foil having a face-centered cubic structure to exhibit a cubic texture;wherein the cubic crystal exhibits a preferred orientation in which an occupied area ratio of a region in which one of fundamental crystal axes <100> of a unit lattice of the face-centered cubic structure is located within an orientation difference of 10° relative to a thickness direction of the metal foil is equal to or larger than 50%, and exhibits a preferred orientation in which an occupied area ratio of a region in which another one of the fundamental crystal axes <100> of a unit lattice of the face-centered cubic structure is located within an orientation difference of 10° relative to a direction in a foil surface is equal to or larger than 50%. |
地址 |
Tokyo JP |