Silicon Wafer Pre-alignment Device and Method Therefor

摘要

A wafer pre-alignment device is disclosed, including a first unit configured to drive a wafer to rotate or move upward or downward, a second unit configured to drive the wafer to translate, and a position detector including a light source, a lens and an image sensor. A light beam from the light source passes through the wafer and the lens and thereby provides information indicating a position of the wafer to the image sensor. The first unit and the second unit are able to adjust the position of the wafer based on the information obtained by the image sensor. A method for pre-aligning a TSV wafer is also disclosed.

主权项

1. A wafer pre-alignment device, comprising:
a first unit configured to drive a wafer to rotate or move upward or downward, the first unit comprising a first chuck for retaining the wafer; a second unit configured to drive the wafer to translate relative to the first chuck; a position detector comprising a light source, an image sensor disposed above the first chuck, and a lens disposed under the first chuck, wherein a light beam from the light source passes through the wafer, the first chuck and the lens and thereby provides information indicating a position of the wafer relative to the first chuck on to the image sensor, wherein the first unit and the second unit are configured to adjust the position of the wafer relative to the first chuck based on the information obtained by the image sensor.