MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SAME

摘要

The invention relates to a multilayer printed circuit board and a method for producing same. To increase the power density of such a multilayer printed circuit board, said board comprises • at least a first layer comprising a first electrically insulating substrate (1) and at least a first conductor (2) which is applied to the first substrate (1) and • at least a second layer comprising a second electrically insulating substrate (1) and at least a second conductor (2) which is applied to the second substrate (1), wherein the two layers are mechanically connected to one another by means of an enamel coating layer (4) lying between the first and second conductors (2).