发明名称 SPUTTERING APPARATUS TO PREVENT THIN FILM LIKE ORGANIC LAYER FORMED ON SUBSTRATE FROM BEING DAMAGED
摘要 PURPOSE: A sputtering apparatus is provided to prevent a thin film like an organic layer formed on a substrate from being damaged by including a magnetic shielding unit and/or electrical blocking unit between a target part and the substrate and by preventing electrons and Ar+ ions from transferring toward the substrate. CONSTITUTION: A chamber(111) is filled with sputtering gas. A target part(120) makes the sputtering gas have a plasma state, installed in the chamber and including a target(121) and a magnetic field generating unit(130) for generating a magnetic filed such that the magnetic field generating unit is installed in a side of the target part. A substrate support part supports a substrate(113) on which the target particles discharged from the target are deposited, disposed in a position of the chamber confronting the target part. A blocking unit prevents the electrons and positive ions of the plasma formed in the chamber from migrating to the substrate to avoid a collision between the electrons/positive ions and the substrate, disposed between the target part and the substrate support part.
申请公布号 KR20050018508(A) 申请公布日期 2005.02.23
申请号 KR20030056427 申请日期 2003.08.14
申请人 SAMSUNG SDI CO., LTD. 发明人 CHOI, CHAUN GI;KIM, SU GUN
分类号 H01L21/203;(IPC1-7):H01L21/203 主分类号 H01L21/203
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