| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which shows practically sufficient flexibility even after photocuring, also exhibits excellent resistance to the heat of soldering and excellent plating resistance, and is applicable as a permanent mask resist for FPC. <P>SOLUTION: The photosensitive resin composition includes: (A) a resin having carboxyl group; (B) a compound having a benzoxazine skeleton; (C) a photopolymerizable compound; and (D) a photopolymerization initiator. <P>COPYRIGHT: (C)2009,JPO&INPIT |
