Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

摘要

A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate. Prior to bonding, the first copper plate has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.

主权项

1. A power module substrate, the substrate comprising:
an insulating substrate; and a circuit layer that is formed on one surface of the insulating substrate, wherein the circuit layer is formed by bonding a first copper plate onto the one surface of the insulating substrate, and wherein, prior to bonding, the first copper plate consists essentially of:
copper, andeither:
a total of 1 to 100 mol ppm of one or more alkaline-earth elements, transition metal elements, and rare-earth elements; or100 to 1000 mol ppm of boron.