发明名称 INJECTION MOLDING DEVICE AND INJECTION MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an injection molding device and an injection molding method, capable of suppressing extension of an injection molding cycle, and suppressing occurrence of appearance defect of a molded article, when a conductive material is injection molded.SOLUTION: An injection molding device comprises heating injection means for, heating and melting a conductive material to fluidization possible temperature, and injecting it in a molding die. The molding die comprises: energization means for, comprising plural conductive parts which are insulated each other on at least a part of a cavity formation plane, and applying predetermined voltage among the conductive parts; and energization control means for controlling voltage applied by the energization means. The energization control means applies the voltage among the conductive parts by the energization means, so that the injected conductive material is energized and heated when it contacts the conductive parts of the molding die.SELECTED DRAWING: Figure 1
申请公布号 JP2016128235(A) 申请公布日期 2016.07.14
申请号 JP20150003617 申请日期 2015.01.09
申请人 MAZDA MOTOR CORP 发明人 KATO HIDEKAZU;TANAKA TAKAHIRO;TANIZAWA HIROKI;WAKU NAOTO
分类号 B29C45/72;B22C9/06;B22D17/22;B22D17/32;B22D27/02;B22D27/04;B29C45/26;B29C45/76 主分类号 B29C45/72
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