| 摘要 |
PROBLEM TO BE SOLVED: To perform alignment of substrates with high throughput and to align a wafer precisely to an exposure position when the wafer is exposed.SOLUTION: A control unit controls a driving system of a reticle stage and that of a wafer stage WST, when an exposure action is performed, so that alignment of the wafer W is performed and scanning exposure of the wafer is conducted on the basis of the detection information of alignment systems (AL1, AL2-AL2). The control unit controls the driving system of the wafer stage WST, when a detection action is performed by the alignment systems, so that the wafer is moved relatively to the Y direction in a plurality of detection regions in order to detect a plurality of marks, the position of one of which differs from that of another of which in the Y direction, in at least a part of the detection regions of the alignment systems (AL1, AL2-AL2).SELECTED DRAWING: Figure 3 |
