发明名称 |
THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING SAME |
摘要 |
A method for manufacturing a thin film transistor include following steps. A substrate is provided. A gate electrode and an electrically insulating layer are formed on the substrate. An electric conducting layer is formed on the electrically insulating layer. A first photoresist pattern layer is formed on the electric conducting layer. A portion of the electric conducting layer which is not covered by the first photoresist pattern layer is etched to form an electric conduction layer. A semiconductor layer is formed on the electric conduction layer. A second photoresist pattern layer is formed. A portion of the semiconductor layer which is not covered by the second photoresist pattern layer is etched to form the channel layer covering the electric conduction layer. A source electrode and a drain electrode are formed at the two lateral portions of the channel layer respectively. The thin film transistor is also provided. |
申请公布号 |
US2016351719(A1) |
申请公布日期 |
2016.12.01 |
申请号 |
US201514834608 |
申请日期 |
2015.08.25 |
申请人 |
HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
SHIH PO-LI;KAO YI-CHUN;LEE CHIH-LUNG;FANG KUO-LUNG;LIN HSIN-HUA |
分类号 |
H01L29/786;H01L27/12 |
主分类号 |
H01L29/786 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of manufacturing a thin film transistor, the method comprising:
providing a substrate; successively forming a gate electrode and an electrically insulating layer on the substrate; forming an electric conducting layer on the electrically insulating layer; forming a first photoresist layer on the electric conducting layer; photolithographing the first photoresist layer from a top face and a bottom face by using a photo mask as a top face photo mask and the gate electrode as a bottom face photo mask to form a first photoresist pattern layer; etching a portion, which is not covered by the first photoresist pattern layer, of the electric conducting layer to form an electric conduction layer; forming a semiconductor layer on the electric conduction layer; forming a second photoresist layer on the semiconductor layer; photolithographing the second photoresist layer from a top face and a bottom face using the photo mask as a top face photo mask and the gate electrode as a bottom face photo mask to form a second photoresist pattern layer; etching a portion, which is not covered by the second photoresist pattern layer, of the semiconductor layer to form a channel layer covering the electric conduction layer; and forming a source electrode and a drain electrode at two lateral portions of the channel layer respectively. |
地址 |
New Taipei TW |