发明名称 THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING SAME
摘要 A method for manufacturing a thin film transistor include following steps. A substrate is provided. A gate electrode and an electrically insulating layer are formed on the substrate. An electric conducting layer is formed on the electrically insulating layer. A first photoresist pattern layer is formed on the electric conducting layer. A portion of the electric conducting layer which is not covered by the first photoresist pattern layer is etched to form an electric conduction layer. A semiconductor layer is formed on the electric conduction layer. A second photoresist pattern layer is formed. A portion of the semiconductor layer which is not covered by the second photoresist pattern layer is etched to form the channel layer covering the electric conduction layer. A source electrode and a drain electrode are formed at the two lateral portions of the channel layer respectively. The thin film transistor is also provided.
申请公布号 US2016351719(A1) 申请公布日期 2016.12.01
申请号 US201514834608 申请日期 2015.08.25
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 SHIH PO-LI;KAO YI-CHUN;LEE CHIH-LUNG;FANG KUO-LUNG;LIN HSIN-HUA
分类号 H01L29/786;H01L27/12 主分类号 H01L29/786
代理机构 代理人
主权项 1. A method of manufacturing a thin film transistor, the method comprising: providing a substrate; successively forming a gate electrode and an electrically insulating layer on the substrate; forming an electric conducting layer on the electrically insulating layer; forming a first photoresist layer on the electric conducting layer; photolithographing the first photoresist layer from a top face and a bottom face by using a photo mask as a top face photo mask and the gate electrode as a bottom face photo mask to form a first photoresist pattern layer; etching a portion, which is not covered by the first photoresist pattern layer, of the electric conducting layer to form an electric conduction layer; forming a semiconductor layer on the electric conduction layer; forming a second photoresist layer on the semiconductor layer; photolithographing the second photoresist layer from a top face and a bottom face using the photo mask as a top face photo mask and the gate electrode as a bottom face photo mask to form a second photoresist pattern layer; etching a portion, which is not covered by the second photoresist pattern layer, of the semiconductor layer to form a channel layer covering the electric conduction layer; and forming a source electrode and a drain electrode at two lateral portions of the channel layer respectively.
地址 New Taipei TW