发明名称 ONE PACK MOISTURE-CURABLE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a one pack moisture-curable composition hardly generating layer separation and thickening during storage. SOLUTION: This composition comprises (a) a modified silicone resin, (b) a curing agent for the modified silicone resin, (c) an epoxy resin, (d) a hydrophilic ketimine as a curing agent for the epoxy resin and (e) hydrophobic silica fine powder. The amount of each component compounded based on 100 pts.wt. of (c) the epoxy resin is, preferably, 5-300 pts.wt. for (d) the hydrophilic ketimine, 10-1,000 pts.wt. for (a) the modified silicone resin, 1-25 pts.wt. for (b) the curing agent for the modified silicone resin and 1-30 pts.wt. for (e) the hydrophobic silica fine powder. This one pack moisture-curable composition is used as an adhesive, a sealing material, a paint or the like and is suitably employed, in particular, as a primer for sticking a cement-containing article to various grounds.
申请公布号 JP2000044773(A) 申请公布日期 2000.02.15
申请号 JP19980212906 申请日期 1998.07.28
申请人 KONISHI CO LTD 发明人 ASAI NOBUYUKI;KITAZAWA HIDEHIRO;HORII KYUICHI;ITO YASUO
分类号 C08K3/36;C08G59/40;C08L63/00;C08L83/04;C09J163/00;C09J183/04;(IPC1-7):C08L63/00 主分类号 C08K3/36
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