| 摘要 |
<P>PROBLEM TO BE SOLVED: To prepare a sheet semiconductor sealing resin composition which is suitably used in flip chip packaging, maintains a pattern recognizable transmission, can obtain excellent workability, and brings about excellent electrical connection reliability after resin sealing, and to provide a semiconductor device resin-sealed by using the composition. <P>SOLUTION: This sheet semiconductor sealing resin composition has a viscosity measured at 80°C of ≤10,000 Pa s and comprises (A) an epoxy resin having at least two epoxy groups in the molecule, (B) a curing agent, and (C) silica particles having an average particle diameter dmax of 3-50 nm and a half width of ≤1.5 times the average particle diameter dmax. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
