| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plating method which can be applied to manufacturing a small-sized high-frequency line, and a high-frequency line which is manufactured by the plating method, can be miniaturized and reduces a transmission loss. <P>SOLUTION: The method for plating a compound member including a first portion composed of a first resin including a charging material and a second portion composed of a material different from that of the first portion includes a pre-treatment step for treating the compound member using a surface treatment liquid with which the charging material is dissolved and a surface state of the second portion is not substantially changed, and a plating step for applying electroless plating to the compound material treated by the pre-treatment step, thereby selectively forming a plating film over the first portion. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
