| 发明名称 |
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT |
| 摘要 |
In various embodiments, an integrated circuit is provided. The integrated circuit may include a semiconductor chip and an electrically conductive composite material fixed to the semiconductor chip, wherein the electrically conductive composite material may include a metal, and wherein a coefficient of thermal expansion (CTE) value of the electrically conductive composite material may be lower than the CTE value of the metal. |
| 申请公布号 |
US2016211226(A1) |
申请公布日期 |
2016.07.21 |
| 申请号 |
US201614987820 |
申请日期 |
2016.01.05 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Fuergut Edward;Mahler Joachim;Nikitin Ivan |
| 分类号 |
H01L23/00;H01L21/78;H01L21/48;H01L21/56;H01L23/495;H01L23/31 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit, comprising:
a semiconductor chip; and electrically conductive composite material fixed to the semiconductor chip, wherein the electrically conductive composite material comprises a metal, and wherein a coefficient of thermal expansion (CTE) value of the electrically conductive composite material is lower than the CTE value of the metal. |
| 地址 |
Neubiberg DE |
