CHIP CAPACITOR, CIRCUIT ASSEMBLY, AND ELECTRONIC DEVICE

摘要

A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.

主权项

1. A chip part comprising
a substrate having an element forming surface, a composite element including a first element and a second element that are formed mutually independently on the element forming surface and having external connection electrodes constituted of the two electrodes of a first external connection electrode and a second external connection electrode, a first internal electrode and a second internal electrode formed as one and another pole of the first element, a third internal electrode and a fourth internal electrode formed as one and another pole of the second element, and wherein the first external connection electrode is connected in common to the first internal electrode and the third internal electrode and the second external connection electrode is connected in common to the second internal electrode and the fourth internal electrode.