| 发明名称 |
COOLING MODULE AND ELECTRONIC DEVICE |
| 摘要 |
A cooling module includes: a heat exchanger mounted on an electronic part mounted on a board, and that cools the electronic part; a leaf spring including an overhang portion and an extension portion, the overhang portion overhanging outward beyond the heat exchanger from the heat exchanger, and the extension portion extending from the overhang portion in a direction intersecting an overhang direction of the overhang portion when viewed in a thickness direction of the board; and a support member located around the heat exchanger, and fixed to the board, the extension portion bent toward the board being attached to the support member. |
| 申请公布号 |
US2016327996(A1) |
申请公布日期 |
2016.11.10 |
| 申请号 |
US201615139846 |
申请日期 |
2016.04.27 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
SASABE KENJI;Kubo Hideo;So Tsuyoshi;Aoki Nobumitsu;Watanabe Masayuki;TAWA Fumihiro;Uzuka Yoshinori |
| 分类号 |
G06F1/20;F28F1/32;F28F3/02;F28D1/053;F28D15/02;F28F9/00 |
主分类号 |
G06F1/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cooling module, comprising:
a heat exchanger mounted on an electronic part mounted on a board, and that cools the electronic part; a leaf spring including an overhang portion and an extension portion, the overhang portion overhanging outward beyond the heat exchanger from the heat exchanger, and the extension portion extending from the overhang portion in a direction intersecting an overhang direction of the overhang portion when viewed in a thickness direction of the board; and a support member located around the heat exchanger, and fixed to the board, the extension portion bent toward the board being attached to the support member. |
| 地址 |
Kawasaki-shi JP |
