METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT

摘要

Disclosed is a method for producing an optoelectronic component comprising the steps: providing a lead frame comprising an upper face having a contact region and a chip accommodating region which is raised with respect to the contact region; arranging a electrically conductive element on the contact region; embedding the lead frame in a moulded body, wherein the contact region is covered by the moulded body, and the chip accommodating region and the electrically conductive element remain accessible on an upper face of the moulded body; arranging an optoelectronic semiconductor chip on the chip accommodating region; and connecting the optoelectronic semiconductor chip and the electrically conductive element by means of a bonding wire.