| 摘要 |
A flip chip package is provided to solve a problem occurring in a solder ball paste bump process by forming a photoresist layer on the surface of a chip by a photolithography process. A semiconductor chip(31) and a PCB(printed circuit board) are prepared. Photoresist is formed on a chip pad(33) formed on the semiconductor chip and on the semiconductor chip except the chip pad. The semiconductor chip is electrically connected to the PCB by an alloy layer(57) formed on the chip pad. A solder ball is mounted on the lower part of the PCB.
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