METHOD FOR ELECTROPLATING NI-P-B ALLOY AND ITS PLATING SOLUTION

摘要

To provide a Ni-P-B alloy electroplating method for forming a plating layer having excellent heat resistance, corrosion resistance and mechanical properties compared with a Ni-P or Ni-P binary plating layer by forming a high speed plating layer and forming a Ni-P-B plating layer having small electrodeposition stress and improving stability in the plating solution and a plating liquid used in the method. The Ni-P-B alloy electroplating method is characterized in that electroplating is executed in a current density range of 1 to 100 A/dm^2, a temperature range of 25 to 60 deg.C and a pH range of 0 to 5 using a plating solution comprising a plating liquid consisting of nickel sulfamate(Ni(SO3NH2)2) or nickel sulfate(Ni(SO4)) as a nickel supply source, phosphorus acid(H3PO3) as a phosphorus supply source and DMAB(dimethyl amine borane complex) or TMAB(trimethyl amine borane complex) as a boron supply source, and boracic acid(H3BO3) functioning as buffer agent and polishing agent. The Ni-P-B alloy plating liquid has a composition comprising 1.0 to 2.0 mol/L of nickel sulfamate(Ni(SO3NH2)2) or nickel sulfate(Ni(SO4)) as a nickel supply source, 0.0005 to 0.1 mol/L of phosphorus acid(H3PO3) as a phosphorus supply source and 0.0001 to 0.01 mol/L of DMAB(dimethyl amine borane complex) or TMAB(trimethyl amine borane complex) as a boron supply source.