| 摘要 |
A layered panel structure featuring a first layer formed of non-thermoformable material, having opposite faces, a thickness T as measured between its opposite faces, and an effective layer density d, and a second layer formed of thermoformable material having opposite faces, with one face in the second layer being thermally bonded to one face in the first layer, and with the second layer having a thickness t, as measured between its opposite faces which is smaller than T, and an effective layer density D which is greater than d. The thermal bond between the layers is formed, during thermoforming of the panel structure, by a melt and flow of resin contained in the thermoformable layer material.
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