发明名称 WAFER PROCESSING HARDWARE FOR EPITAXIAL DEPOSITION WITH REDUCED BACKSIDE DEPOSITION AND DEFECTS
摘要 Methods and apparatus for reducing autodoping and backside defects on a substrate during epitaxial deposition processes are provided herein. In some embodiments, an apparatus for reducing autodoping and backside defects on a substrate includes a substrate support ring having a substrate holder structure configured to support the substrate in a position for processing along an edge defined by the backside of the substrate and a sidewall of the substrate or along a plurality of discrete points on or proximate to the edge; and a spacer ring for positioning the substrate support ring above a susceptor plate to define a substrate gap region between the susceptor plate and the backside of the substrate, the spacer ring comprising a plurality of openings formed therethrough that facilitate passage of a gas into and out of the substrate gap region.
申请公布号 US2008066684(A1) 申请公布日期 2008.03.20
申请号 US20070868289 申请日期 2007.10.05
申请人 APPLIED MATERIALS, INC. 发明人 PATALAY KAILASH KIRAN;METZNER CRAIG;VATUS JEAN
分类号 C23C16/00 主分类号 C23C16/00
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