| 发明名称 | Integrated circuit package system with mounting features for clearance | ||
| 摘要 | An integrated circuit package system is provided including providing a substrate having a contact pad, forming a first conductor having a first melting point over the contact pad, forming a second conductor having a second melting point over the first conductor with the first melting point higher than the second melting point, and mounting a first device over the second conductor. | ||
| 申请公布号 | US9084377(B2) | 申请公布日期 | 2015.07.14 |
| 申请号 | US200711694913 | 申请日期 | 2007.03.30 |
| 申请人 | STATS ChipPAC Ltd. | 发明人 | Chow Seng Guan |
| 分类号 | H05K3/34;H05K3/28;H05K1/11;H05K3/12;H05K3/40 | 主分类号 | H05K3/34 |
| 代理机构 | Ishimaru & Associates LLP | 代理人 | Ishimaru & Associates LLP |
| 主权项 | 1. A method for manufacturing an integrated circuit package comprising: providing a substrate having a contact pad; forming a first conductor having a first melting point, a first width, and a first height over the contact pad; forming a second conductor having a second melting point, a second width, and a second height over the first height of the first conductor with the first melting point higher than the second melting point and the second width less than or substantially equal to the first width; mounting a first device over the second conductor; and coupling a second device to a bond pad, in the substrate, adjacent to the contact pad. | ||
| 地址 | Singapore SG | ||