| 摘要 |
PROBLEM TO BE SOLVED: To provide soldering equipment which can easily obtain an excellent soldering condition, avoiding the cause of the occurrence of the defect of a work to be soldered in which a metal substrate having a high heat dissipation property is superposed with a printed-wiring substrate on which an electronic component is mounted. SOLUTION: A work to be soldered 20 is set in a contact state on a heating stage 9. Soldering is performed after the work to be soldered 20 is fully heated by heating the heating stage 9. COPYRIGHT: (C)2009,JPO&INPIT |
