发明名称 POWER MODULE
摘要 PROBLEM TO BE SOLVED: To provide a power module structure which can improve the reliability of an output terminal in a power module.SOLUTION: A power module 100 comprises: a ceramic substrate 11 which has a first conductor layer on a first principal surface, with a first margin remaining on the outer periphery, and a second conductor layer on a second principal surface, with a second margin remaining on the outer periphery; a diode 2 which is fixed to the second conductor layer of the ceramic substrate; a transistor 1 which is provided with a control electrode and is fixed to the second conductor layer of the ceramic substrate; a first terminal 7 which is connected to the second conductor layer of the ceramic substrate; a second terminal 6 for connecting the diode and the transistor to each other; a third terminal which is connected, with a wire, to the control electrode of the transistor; an insulative bridging member 3 which is fixed to the second terminal so as to hold the third terminal; a case 5 which is bonded to the ceramic substrate, and which houses the diode, the transistor, the first terminal, the second terminal, the third terminal and the bridging member; and a sealing resin member 15 which is filled inside the case.
申请公布号 JP2015133462(A) 申请公布日期 2015.07.23
申请号 JP20140005583 申请日期 2014.01.16
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJINO JUNJI;ISHIHARA MIKIO;YAMADA KOJI;MAFUNE MASAYUKI
分类号 H01L25/07;H01L23/48;H01L25/18 主分类号 H01L25/07
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