发明名称 CHEMICAL MECHANICAL POLISHING PAD, POLISHING LAYER ANALYZER AND METHOD
摘要 PROBLEM TO BE SOLVED: To reinforce identification performance of a polishing layer defect in a chemical mechanical polishing pad.SOLUTION: A plurality of polymer sheets are conveyed one by one at a time between a light source and a photodetector. The light source faces a collision surface 17, and the photodetector detects transmitted light of the polymer sheet. The intensity of transmitted light is converted to an electric signal by the photodetector, and the electric signal from the photodetector is converted to a digital signal by a digital image data acquisition device. The digital signal from the digital image data acquisition device is processed by an image data processing unit, and the image data processing unit detects macro ununiformity, and classifies whether to allow the polymer sheet. The plurality of polymer sheets are divided into a group of allowable sheets and a group of non-allowable sheets.SELECTED DRAWING: Figure 1
申请公布号 JP2016136136(A) 申请公布日期 2016.07.28
申请号 JP20150251945 申请日期 2015.12.24
申请人 ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC;DOW GLOBAL TECHNOLOGIES LLC 发明人 FRANCIS V ACHOLLA;WANK ANDREW R;MARK GAZZE;SCOTT CHANG;JEFF TSAI;WILLIAM A HEESCHEN;JAMES DAVID TATE;LEO H CHIANG;SWEE-TENG CHIN
分类号 G01N21/88;H01L21/304 主分类号 G01N21/88
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