PHOTOCURABLE THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, AND PRINTED WIRING BOARD

摘要

Provided are: a photocurable thermosetting resin composition which has both excellent sensitivity and excellent solder heat resistance; a cured product of this photocurable thermosetting resin composition; and a printed wiring board. A photocurable thermosetting resin composition which contains a carboxyl group-containing photosensitive organic-inorganic hybrid resin varnish (A), a photopolymerization initiator (B) and an organic nitrogen compound (C). The carboxyl group-containing photosensitive organic-inorganic hybrid resin varnish (A) is obtained by having a compound (A-2) partially react with a hydroxyl group of a photosensitive resin (A-1) containing a carboxyl group. The photosensitive resin (A-1) is obtained by having an unsaturated monocarboxylic acid (a2) react with an epoxy group of a polyfunctional epoxy resin (a1), and then having the reaction product react with a polybasic acid anhydride (a3) so that some of hydroxyl groups remain therein. The compound (A-2) is obtained by subjecting silane compounds including at least one silane compound having a (meth)acryloyl group to a hydrolysis-condensation reaction.