| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling module which can cool a semiconductor element effectively without forming a passage in and out of the semiconductor element, and to provide a semiconductor device.SOLUTION: A cooling module 1 includes a hollow member 2 having a bonded surface 4 facing the surface of a semiconductor element on the outside, and having a passage 5 through which refrigerant flows on the inside, and a heat conductive member 3 arranged at a part of the bonded surface corresponding to a solder bump attached to the semiconductor element, so that a heat exchange surface 7 on the back side of a welded surface 6 to which a solder bump is welded is exposed into the passage. |
