TITLE: INTEGRATED PACKAGING FOR MULTI-COMPONENT SENSORS

摘要

Technologies are generally described for fabrication of a multi-component device, and employment thereof. The device may include a substrate, and a multitude of light sources and one or more photo detectors positioned on a surface of the substrate. The light sources may be configured to illuminate at least a portion of an object with light, and the photo detectors may be configured to detect reflected light from the object in response to the illumination. In some examples, the reflected light may be analyzed to determine a spectral profile of the object. The device may further include a structure applied to the substrate adjacent to the photo detectors, where the structure may be configured to reduce direct light transmission from the light sources to the photo detectors. The structure may include a deposited material, a protrusion, and/or a recession on the surface of the substrate, for example.

主权项

1. An apparatus with multiple integrated components, the apparatus comprising:
a substrate; one or more photo detectors positioned on a surface of the substrate; light sources positioned on the surface of the substrate, wherein the light sources are arranged such that each photo detector has a plurality of adjacent light sources; and a structure positioned on the substrate adjacent to each photo detector, the structure configured to reduce direct light transmission from the light sources to the one or more photo detectors, wherein the structure comprises one or more of a material deposited on the surface of the substrate, a protrusion in a central position on the surface of the substrate, and a recession in the central position on the surface of the substrate.