| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of improving washing effect on a wafer surface, while suppressing deterioration in smoothness on the wafer surface as well as deterioration in productivity.SOLUTION: A polishing device comprises: a polishing head which conveys a wafer to the lower side while holding the wafer; and polishing cloth which comes into contact with a surface of the wafer that has been conveyed to the lower side by the polishing head so as to polish the surface of the wafer. The polishing device further comprises: a washing part which comes into contact with the surface of the wafer that has been conveyed to the lower side by the polishing head so as to wash the surface of the wafer; and a position control part which positions, when polishing the wafer, the polishing head on the upper side of the polishing cloth by moving the polishing head, the polishing cloth or both of them, and positions, after polishing the wafer, the polishing head on the upper side of the washing part by moving the polishing head, the polishing cloth or both of them.SELECTED DRAWING: Figure 1 |
