发明名称 POWER SEMICONDUCTOR MODULE
摘要 A power semiconductor module includes: a positive arm and a negative arm that are formed by series connection of self-arc-extinguishing type semiconductor elements and that are connected at a connection point between the self-arc-extinguishing type semiconductor elements; a positive-side DC electrode, a negative-side DC electrode, and an AC electrode that are connected to the positive arm and the negative arm; and a substrate on which a wiring pattern is formed, the wiring pattern connecting the self-arc-extinguishing type semiconductor elements of the positive arm and the negative arm to the positive-side DC electrode, the negative-side DC electrode and the AC electrode. The positive-side DC electrode, the negative-side DC electrode, and the AC electrode are insulated from one another and arranged such that one of the electrodes faces each of the other two electrodes.
申请公布号 US2016358895(A1) 申请公布日期 2016.12.08
申请号 US201415117963 申请日期 2014.06.30
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 NAKASHIMA Junichi;TAMADA Yoshiko;NAKAYAMA Yasushi;HAYASHIDA Yukimasa
分类号 H01L25/07;H01L29/861;H01L29/41;H01L23/31;H01L29/16;H01L29/20 主分类号 H01L25/07
代理机构 代理人
主权项 1. A power semiconductor module comprising: positive/negative arms as a positive arm and a negative arm that are formed by series connection of self-arc-extinguishing type semiconductor elements, the positive arm and the negative arm being connected at a series connection point between the self-arc-extinguishing type semiconductor elements; a positive-side electrode, a negative-side electrode, and an AC electrode that are connected to the positive arm and the negative arm; and a substrate on which a wiring pattern is formed, the wiring pattern connecting the self-arc-extinguishing type semiconductor elements of the positive arm and the negative arm to the positive-side electrode, the negative-side electrode and the AC electrode, each of the positive-side electrode, the negative-side electrode, and the AC electrode including a parallel surface portion arranged to be parallel to a surface of the substrate on which the wiring pattern is formed, the substrate d the parallel surface portion of each of the positive-side electrode, the negative-side electrode and the AC electrode being insulated from each other with a sealing material interposed therebetween, and the positive-side electrode, the negative-side electrode, and the AC electrode being insulated from one another, and arranged such that two of the positive-side electrode, the negative-side electrode and the AC electrode face each other at a distance from each other.
地址 Tokyo JP