发明名称 |
POWER SEMICONDUCTOR MODULE |
摘要 |
A power semiconductor module includes: a positive arm and a negative arm that are formed by series connection of self-arc-extinguishing type semiconductor elements and that are connected at a connection point between the self-arc-extinguishing type semiconductor elements; a positive-side DC electrode, a negative-side DC electrode, and an AC electrode that are connected to the positive arm and the negative arm; and a substrate on which a wiring pattern is formed, the wiring pattern connecting the self-arc-extinguishing type semiconductor elements of the positive arm and the negative arm to the positive-side DC electrode, the negative-side DC electrode and the AC electrode. The positive-side DC electrode, the negative-side DC electrode, and the AC electrode are insulated from one another and arranged such that one of the electrodes faces each of the other two electrodes. |
申请公布号 |
US2016358895(A1) |
申请公布日期 |
2016.12.08 |
申请号 |
US201415117963 |
申请日期 |
2014.06.30 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
NAKASHIMA Junichi;TAMADA Yoshiko;NAKAYAMA Yasushi;HAYASHIDA Yukimasa |
分类号 |
H01L25/07;H01L29/861;H01L29/41;H01L23/31;H01L29/16;H01L29/20 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
1. A power semiconductor module comprising:
positive/negative arms as a positive arm and a negative arm that are formed by series connection of self-arc-extinguishing type semiconductor elements, the positive arm and the negative arm being connected at a series connection point between the self-arc-extinguishing type semiconductor elements; a positive-side electrode, a negative-side electrode, and an AC electrode that are connected to the positive arm and the negative arm; and a substrate on which a wiring pattern is formed, the wiring pattern connecting the self-arc-extinguishing type semiconductor elements of the positive arm and the negative arm to the positive-side electrode, the negative-side electrode and the AC electrode, each of the positive-side electrode, the negative-side electrode, and the AC electrode including a parallel surface portion arranged to be parallel to a surface of the substrate on which the wiring pattern is formed, the substrate d the parallel surface portion of each of the positive-side electrode, the negative-side electrode and the AC electrode being insulated from each other with a sealing material interposed therebetween, and the positive-side electrode, the negative-side electrode, and the AC electrode being insulated from one another, and arranged such that two of the positive-side electrode, the negative-side electrode and the AC electrode face each other at a distance from each other. |
地址 |
Tokyo JP |