封装基板及其制法暨半导体封装件及其制法;PACKAGE SUBSTRATE AS WELL AS MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR PACKAGE AS WELL AS MANUFACTURING METHOD THEREOF

摘要

一种封装基板，系包括：层状本体；形成于该层状本体表面上之复数导电元件；以及形成于对应之各该导电元件上之定位结构，以藉由该定位结构改善上下封装元件彼此定位接合的问题，提高制造良率与产品品质。本发明复提供该封装基板之制法、半导体封装件及其制法。; a plurality of conductive elements formed on the layer-like main body surface; and a positioning structure formed corresponding to each conductive element, so that an issue of the upper and lower packaged components positioning engaging with each other can be improved by the positioning structure, and the manufacturing yield and product quality can be enhanced. This invention further provides a manufacturing method of the package substrate, a semiconductor package and a manufacturing method thereof.