| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition excellent in physical properties of a cured film, and a semiconductor device and a display element, wherein the resin composition is excellent in imparting low stress to a substrate. <P>SOLUTION: The resin composition comprises an alkali-soluble resin (A) and a reaction product (B) of a bisoxazoline derivative and a dicarboxylic acid. A reaction product obtained by allowing 0.3 to 3 mol of the bisoxazoline derivative to react with one mol of the dicarboxylic acid is preferably used. Moreover, a resin composition having developability can be obtained by incorporating a compound (C) which generates an acid by light into the composition. <P>COPYRIGHT: (C)2007,JPO&INPIT |
