| 摘要 |
PURPOSE: A fabrication method of hybrid integrated circuit device is provided to lessen a working time in a process for attaching from small-sized parts to large-sized parts in good order. CONSTITUTION: After chip parts(4) fixed by solder paste, a bump(1) and a power transistor(11) are collectively printed by a solder cream on the resultant structure. At this time, they are collectively mounted. At this time, a simple line, instead of making a plurality of the conventional solder melting processes, is realized by collectively melting it in an N2 reflow solder melting furnace. At this point, the simple line making a plurality of the solder melting process is performed in one time. So manufacturing cost and time are reduced. |
