发明名称 INSPECTION DEVICE, INSPECTION METHOD AND MANUFACTURING METHOD FOR CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an inspection device capable of determining the presence of a defect in a plurality of modules included in a circuit device, without providing an inspecting pad or a dedicated additional circuit in the circuit device, an inspection method therefor, and a manufacturing method for the circuit device capable of relieving the defect, while restraining a circuit size from increasing, by using the inspection method. SOLUTION: A semiconductor integrated circuit includes the plurality of modules with functions substitutable each other. The semiconductor integrated circuit is controlled to change the function allocated to the each module in at least one part of the plurality of modules, while keeping the functions allocated to the whole modules. The change of function of the semiconductor integrated circuit is detected in response to the change in the allocation of module function, and the presence of the defect in the at least one part of the modules is determined in response to a detection result therein. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007101395(A) 申请公布日期 2007.04.19
申请号 JP20050292421 申请日期 2005.10.05
申请人 SONY CORP 发明人 ONODERA TAKASHI
分类号 G01R31/3183;G11C29/04;G11C29/44;H01L21/822;H01L27/04 主分类号 G01R31/3183
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