Semiconductor device, heat dissipating unit, and method for making a heat dissipating unit

摘要

A heat dissipating unit includes a hat-shaped body of a metal layered structure having: a copper alloy layer having upper and lower surfaces; a nickel layer formed on the upper surface of the copper alloy layer; a chrome layer formed on the nickel layer; and a metal oxide layer formed on the lower surface of the copper alloy layer. A semiconductor device includes: a substrate; a semiconductor chip mounted on the substrate; and a hat-shaped body of a metal layered structure mounted on the substrate and defining an inner space to receive the semiconductor chip therein.