<p>A heat transfer system and method for maintaining or controlling a temperature of a device under test (DUT) with heat generating capability. The heat transfer system comprises a temperature control unit (TCU) for thermal coupling to the DUT, the TCU arranged for flow of a heat transfer medium therethrough; an automatic expansion valve disposed upstream of the TCU; a flow-regulating valve disposed downstream of the TCU; and a controller coupled to the TCU for receiving an input signal representative of a temperature of the DUT; wherein the controller is further coupled to the flow-regulating valve to change a flow area of the flow-regulating valve based on the signal representative of the temperature of the DUT.</p>
申请公布号
WO2009051564(A1)
申请公布日期
2009.04.23
申请号
WO2008SG00143
申请日期
2008.04.28
申请人
AEM SINGAPORE PTE LTD;OOI, KIM TIOW;TEH, YONG LIANG;PHAY, TIEW TOON;NG, PEI FAN FLORENCE
发明人
OOI, KIM TIOW;TEH, YONG LIANG;PHAY, TIEW TOON;NG, PEI FAN FLORENCE