| 摘要 |
The present invention relates to a semiconductor package. According to the present invention, the semiconductor package comprises: a substrate including a circuit layer and an insulation layer; a semiconductor chip mounted on the substrate; a resin layer sealing the semiconductor chip; a protection layer laminated on the resin layer; and a metal layer laminated on the protection layer. Therefore, the semiconductor package minimizes a warpage phenomenon, and obtains an excellent heat radiation feature and an excellent electromagnetic wave shielding feature. |
