| 摘要 |
The invention relates to a new method of providing different and controlled atmospheres inside cavities on one and the same chip of a MEMS device. With the new method one can refrain from providing separate getter materials, and thereby the manufacturing is simplified. The method comprises providing a first substrate (20) and a second substrate (28) and making at least one depression (22', 22'') in at least one of the substrates(20). A structural component (26) is provided in or on a surface of at least one of the substrates, said structure containing entrapped, absorbed or adsorbed ions, molecules or atoms of a gas. The substrates are bonded together such that a cavity forms and becomes hermetically sealed. The obtained structure is subjected to conditions so as to release the implanted, absorbed or adsorbed gas atoms, ions or molecules from the substrate to provide said controlled atmosphere inside the cavity. |
