| 摘要 |
In a method for manufacturing a sandwich component (2) having a first and a second flat side (12a,b), in a pre-assembly state (ZV) all components (3) of the sandwich component (2) in relation to one another are placed in a nominal position (LS): at least one shape-imparting structural layer (4) and a conductor layer (5) having an electrical conductor (8a-d), and are connected in an assembly step (M) with an adhesive (18), wherein in the pre-assembly state (ZV) on both sides of the conductor layer (6) two barrier layers (10a,b) which are vapour-tight are placed as further components (3) and interconnected in such a manner that said two barrier layers (10a,b) enclose the conductor -(8a-d) in a vapour-tight manner. A sandwich component (2) having the flat sides (10a,b), in particular having been manufactured according to the above method, has at least the structural layer (4) and the conductor layer (6) with the conductors (8a-d), said structural layer (4) and said conductor layer (6) , being disposed between the flat sides (12a,b) and connected with the adhesive (18), and on both sides of the conductor layer (6) the barrier layers (10a,b) as further components (3) are interconnected in such a manner that said two barrier layers (10a,b) enclose the conductor (8a-d) in a vapour-tight manner. |
