发明名称 THERMOELECTRIC MODULE
摘要 A thermoelectric module is provided with: a first support substrate including a first surface and a second surface; a second support substrate including a third surface and disposed with the third surface facing the second surface; a plurality of thermoelectric elements arranged between the first support substrate and the second support substrate; and a fin disposed on the first surface of the first support substrate, wherein the fin includes a plurality of board-like portions spaced apart from each other and arranged vertically with respect to the first support substrate, wherein, when viewed in a direction in which the board-like portions are arranged, the interval of the board-like portions is greater at the central portion of the fin than at the ends thereof.
申请公布号 WO2016136856(A1) 申请公布日期 2016.09.01
申请号 WO2016JP55555 申请日期 2016.02.25
申请人 KYOCERA CORPORATION 发明人 FURUKAWA, Tomohiro
分类号 H01L35/30;F25B21/02;H02N11/00 主分类号 H01L35/30
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