LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, AND METHOD OF MANUFACTURING LIGHT EMITTING APPARATUS

摘要

Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting apparatus capable of being used for a display application or an illumination application. The light emitting device package includes: a substrate, a light emitting, a reflection molding member, an upper cover, and an interval maintaining part.

主权项

1. A light emitting device package comprising:
a substrate having a first electrode formed at one side of an electrode separation line and a second electrode formed at the other side of the electrode separation line; a light emitting device including a first pad electrically connected to the first electrode and a second pad electrically connected to the second electrode; a reflection molding member installed on the substrate, having a form in which a front surface thereof is opened so as to induce light generated by the light emitting device toward the front of the light emitting device package, and including a reflection cup part of which an upper portion is opened so as to accommodate the light emitting device therein; an upper cover formed in a shape corresponding to that of an upper surface of the reflection molding member so as to cover the light emitting device and the opened upper portion of the reflection cup part of the reflection molding member; and an interval maintaining part formed at the upper cover such that a predetermined optical interval is maintained between a light guide plate and the light emitting device, the interval maintaining part being protruding from a front surface of the upper cover toward the light guide plate such that a front end thereof contacts the light guide plate.