| 摘要 |
A thermal type sensor molded from a mold resin having an opening has a problem in that the residual stress of the mold resin in the opening causes peeling at the interface having poor adhesion. A physical quantity sensor has a construction having a semiconductor chip having a detector unit 3, a frame 8a on which the semiconductor chip is mounted, a mold resin portion 10 which encapsulates the semiconductor chip and the frame and has an opening through which the detector unit is exposed to the outside, and a stress absorbing layer 6 which is formed between an end of the opening in the mold resin portion and a wiring layer formed in the detector unit, and which is formed from a metal material that absorbs a stress from the end. |
