发明名称 PACKAGING STRUCTURE OF OLED COMPONENT AND PACKAGING METHOD THEREFOR
摘要 A packaging structure of an OLED component and a packaging method therefor. The packaging structure of the OLED component comprises a substrate (1), the OLED component (2) provided on the substrate (1), a first barrier layer (3) formed on the OLED component (2), a desiccant layer (4) formed on the first barrier layer (3), a buffer layer (5) formed on the desiccant layer (4), and a second barrier layer (6) formed on the buffer layer (5). By adding the desiccant layer (4) to the packaging structure for the OLED component, the water vapor resistance of the packaging structure is increased, thus effectively extending the service life of the OLED component. Also, the packaging method for the OLED component effectively prevents intrusion of water vapor, thus increasing packaging effects and effectively extending the service life of the OLED component. Also, the method is simplified and has strong operability.
申请公布号 WO2016201722(A1) 申请公布日期 2016.12.22
申请号 WO2015CN82660 申请日期 2015.06.29
申请人 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 QIAN, Jiajia
分类号 H01L51/56 主分类号 H01L51/56
代理机构 代理人
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