| 摘要 |
<p>An MCM semiconductor device that can operate at a high speed, exhibits a low power consumption and can prevent MCM reliability and yield from being degraded. A signal line between in-chip circuits (30,32) is electrically directly connected to them so as to reduce power consumption and provide a high-speed operation. A protection circuit (406) is provided on the signal line so as to achieve a protection from electrostatic damages. During a device production, when the in-chip circuits (30,32) are connected by use of a connection wire (12), the protection circuit (406) is connected to the signal line (an internal leader line (12a) and an internal wire (14)), thereby absorbing charges, even if caused to flow from semiconductor chips (20,22) into the signal line, by use of the protection circuit (406), whereby the circuit elements can be protected from the static electricity. After completion of the connection, the protection circuit (406) is disconnected from the signal line, so that during a normal use, the protection circuit (406) becomes no loads for the in-chip circuits (30,32), thereby preventing the operation speed from being degraded.</p> |
