发明名称 METHOD FOR FORMING ELECTROLESS-PLATED FILM, AND DEVICE FOR FORMING CATALYST PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a method for forming an electroless-plated film, which can form a thin film of an electrode pattern on a ceramic green sheet and manufacture layered electronic parts of high quality with high productivity; and to provide a device for forming a catalyst pattern for electroless plating. SOLUTION: The method for forming the electroless-plated film comprises the steps of: preparing transferring materials 31 and 41 impregnated with catalyst solutions 32 and 42; making them contact with a ceramic green sheet 1 to form the catalyst patterns 320 and 420 on the sheet 1 by the action of the catalyst solutions 32 and 42; and then, forming the electroless-plated film on the catalyst patterns 320 and 420. The transferring devices 3 and 4 include supports 30 and 40 and the transferring materials 31 and 41. The supports 30 and 40 support the transferring materials 31 and 41, and the transferring materials 31 and 41 have liquid retentivity for the catalyst solutions 32 and 42. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007100139(A) 申请公布日期 2007.04.19
申请号 JP20050288907 申请日期 2005.09.30
申请人 TDK CORP 发明人 KITANO AKIRA;TAKAHARA WATARU;UEDA KANAME
分类号 C23C18/18;C23C18/31;H01G4/12;H01G4/30 主分类号 C23C18/18
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