FLIP-CHIP MODULE AND METHOD FOR THE PRODUCTION THEREOF

摘要

The invention relates to a flip-chip module comprising a semiconductor chip provided with contact columns, which are electrically and mechanically connected to a substrate. A spacer is provided between the substrate and the semiconductor chip and mechanically coupled with the substrate and/or the chip. Thermal stresses in the flip chip module are absorbed by the spacer and are kept away from the semiconductor chip. Said invention also relates to a method for producing a flip chip module consisting in placing the spacer between the semiconductor chip and the substrate and in soldering the contact columns with the substrate contact points. The use of the spacer makes it possible to accurately adjust the distance between the semiconductor chip and the substrate, thereby improving the quality of the soldering points.